Global $6.3 Bn Thermal Management Technologies for Semiconductor Microchips, 2016-2022

Actualizado el 13 de septiembre, 2017 - 20.45hs.

Global $6.3 Bn Thermal Management Technologies for Semiconductor Microchips, 2016-2022

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DUBLIN, September 13, 2017 /PRNewswire/ --

The "Thermal Management Technologies for Semiconductor Microchips" report has been added to Research and Markets' offering.

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This report addresses the global market for thermal management products for microchips during the forecast period through 2022

Unlike SMC024K, The Market for Thermal Management Technologies, which covers the entire semiconductor market based on similar product types and various end-user application industries, the scope of this report covers cooling solutions for microprocessors chips (microchips); selection of suitable thermal management materials; and development of advanced cooling solutions based on several heat-transfer technologies (fans and blowers, heat sinks, heat pipes, cold plates).

Significant advancements in the electronic industry have led to huge demands for smarter products with high power densities. In any such product, many components are attached to an electronic circuit board and many of these components generate heat during any operation.

A microprocessor chip (microchip) is the major source of heat generation in an electronic product; though it consumes power in milliwatts, the power density is very high. When the size of the microchip decreases, its speed increases simultaneously with the heat generation. When that occurs, the adjacent components of a circuit board are severely affected by the high temperature. This necessitates the call for advanced heat-dissipation solutions for microchips. In addition, power electronics, medical devices, and various high-heat applications are designed in compressed sizes and require enhanced thermal technologies to absorb the heat penetration.

This report also highlights the major players in each of the regional markets for thermal management in microchips. It explains the major market drivers of the global thermal management industry, the current trends within the industry, and the regional market dynamics for global thermal management products used in microchips.

The report also provides detailed information about the suppliers involved, along with complete profiles of the major global vendors in the thermal management industry for microchips and data on the market shares of the major players in each region.

Report Highlights:

  • The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
  • The fans and blowers are the largest segment of the hardware market. The market is expected to grow from $1.5 billion in 2017 to $2.1 billion in 2022 at a CAGR of 6.4% for the period 2017-2022.
  • The heat pipes market is expected to grow from $1.0 billion in 2017 to $1.4 billion in 2022 at a CAGR of 7.2% for the period 2017-2022.

Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Summary And Highlights

Chapter 3: Market And Technology Background

Chapter 4: Market Breakdown By Technology Type

Chapter 5: Industry Drivers

Chapter 6: Company Profiles

  • Aavid Thermalloy LLC
  • Alcoa
  • Amkor
  • Ansys
  • Comair Rotron
  • Control Resources
  • Cool Innovations
  • Cps Technologies Corp.
  • Dynatron
  • EBM-Papst
  • ETRI
  • Firepower Technology Llc
  • Intricast/Radian Heatsinks
  • Jaro Thermal
  • Knurr Technical Furniture Gmbh
  • Kooltronic
  • Laird Technologies
  • Liebert Corp.
  • Lytron
  • Marlow Industries Inc.
  • Nmb Technologies Corp.
  • Noren Products
  • Parker Hannifin Corp
  • Polycold Systems
  • Qualtek Electronics Corp.
  • Rittal Corp.
  • Sunon Inc.
  • Tellurex
  • Tennmax
  • Thermacore
  • U-Square Corp.
  • U.S. Toyo Fan Corp.
  • Unitrack Industries
  • Vortec
  • Wakefield-Vette Thermal Solutions

For more information about this report visit https://www.researchandmarkets.com/research/9k42g6/thermal


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